Computer memory cards using flash EEprom integrated circuit chips and memory-controller systems

ABSTRACT

A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional of application Ser. No. 11/157,610, filed Jun. 20,2005, U.S. Pat. No. 7,106,609, which is a continuation of applicationSer. No. 10/628,746, filed Jul. 28, 2003, U.S. Pat. No. 6,947,332 whichis a continuation of application Ser. No. 10/197,027, filed Jul. 16,2002, U.S. Pat. No. 6,628,537 which is a continuation of applicationSer. No. 09/888,167, filed Jun. 22, 2001, now U.S. Pat. No. 6,434,034,which is a continuation of application Ser. No. 09/473,848, filed Dec.28, 1999, now U.S. Pat. No. 6,252,791, which is a division ofapplication Ser. No. 09/121,348, filed Jul. 23, 1998, now U.S. Pat. No.6,011,741, which is a continuation of application Ser. No. 08/907,111,filed Aug. 6, 1997, now U.S. Pat. No. 5,867,417, which is a continuationof application Ser. No. 08/527,254, filed Sep. 12, 1995, now U.S. Pat.No. 5,663,901, which is a continuation of application Ser. No.07/736,732, filed Jul. 26, 1991, now abandoned, which is acontinuation-in-part of application Ser. No. 07/684,034, filed Apr. 11,1991, now abandoned, all of which are hereby incorporated herein by thisreference.

This is also related to another patent application filed concurrentlywith a parent application, entitled “Device and Method for ControllingSolid-State Memory System”, naming Robert D. Norman, Karl M. J. Lofgren,Jeffrey D. Stai, Anil Gupta and Sanjay Mehrotra as inventors, Ser. No.07/736,733, now U.S. Pat. No. 5,430,859, the disclosure of which isincorporated herein by this reference.

BACKGROUND OF THE INVENTION

This invention is related to computer memory systems of a type utilizingsmall, compact semiconductor memory cards, and particularly to astructure within the cards for densely packing a large number ofintegrated circuit chips of electrically erasable and programmableread-only-memory (“EEPROM”) to provide a complete memory system.

Currently, standard microcomputer systems use a combination of fixed andremovable (floppy) magnetic disk media for long-term, non-volatilememory. Semi-conductor random access memory (“RAM”) without a batterypower supply backup is only temporarily used since it is volatile; thatis, when power to the computer system is disconnected, contents of theRAM are lost. A small amount of read only memory (“ROM”) is alsoincluded for permanent storage of certain computer system parametersthat do not change.

There is currently underway an effort to develop non-volatile flashEEPROM memory systems to replace either of the existing fixed or floppymagnetic disk systems, or both. It is now becoming possible to form amegabyte or more of flash EEPROM on a single semiconductor integratedcircuit chip. As a result, several megabytes of memory can be formed ina very small package.

Indeed, an industry “PC Card Standard”, release 1.0, dated August 1990,of the Personal Computer Memory Card International Association (PCMCIA)sets mechanical and electrical interface standards for a memory cardthat is not much larger than an ordinary credit card. Although somephysical dimension variations are permitted within the scope of thisstandard, it is less than 6.0 mm in overall outside thickness, less than5.5 cm in width, and less than 9.0 cm in length. A female type of pinconnector is provided across one of the narrow ends of the cardstructure. Such PC cards have been commercially implemented primarilywith static random-access-memory (“SRAM”) and ROM.

It is a principal object of the present invention to provide a structurefor packaging a large number of flash EEPROM integrated circuit chipswithin such a PC card or other standard structure, thereby providing alarge memory capacity in an individual card or other industry standardphysical configuration.

It is another object of the present invention to provide a completeflash EEPROM system within such an individual card or other standardconfiguration that emulates a floppy or hard disk system.

It is a further object of the present invention to provide such a PCcard structure that is easy to fabricate and test during assembly.

It is yet another object of the present invention to provide an improvedcomputer memory system that utilizes one or more PC cards containingEEPROM integrated circuit chips.

SUMMARY OF THE INVENTION

This and additional objects are accomplished by the various aspects ofthe present invention, wherein, briefly and generally, according to oneaspect, one or more EEPROM memory chips are directly mounted to asubstrate to form a sub-board structure, and one or more of thesub-board structures are then attached to both sides of a main circuitboard that extends through-out an interior of the card package andterminates along one side to form the PC card connector. Each of thesub-boards has a line of electrical terminals along one side thereof ina pattern that matches a pattern of exposed conductors on the mainboard.

In specific implementations, two, three or four such memory chips areprovided in a row along a rectangularly shaped sub-board havingterminals along one of its long dimensions and which is attached to themain board through connection of its terminals with the exposed mainboard contacts. Several such sub-boards can be installed on the mainboard, on one or both sides, within the limits of the PC card standardidentified above. This sub-board structure permits a large number ofEEPROM chips to be included within such a card. It also allows testingof the chips attached to each sub-board before they are assembledtogether on the main board, thus allowing an early identification of anyproblems in the mounting and initial interconnection of the circuitchips.

One type of EEPROM PC card contains only EEPROM memory chips, with theuse of sub-boards as discussed above or otherwise, which are theninterconnected through the card socket to a controller circuit. Thecontroller interfaces between a computer system's main bus and theindividual circuit chips. One, two or more sockets may be provided inconjunction with a given controller for respectively removably receivingone, two or more PC cards at a time. An amount of permanent EEPROMcapacity may optionally be serviced by the same controller circuit.

Another type of flash EEPROM PC card contains a large number ofindividual memory circuit chips, either in the sub-board structuredescribed above or otherwise, plus one or more circuit chips forming acontroller. In this embodiment, each PC card communicates through itsconnector in a format of a computer system bus. Such a PC card isself-contained and no intervening controller circuit is required.

According to another aspect of the present invention, a flash EEPROMsystem is provided with physical form factors which match those ofindustry standard floppy and hard disk drives, along with an electricalinterface that emulates such drives. Such a non-volatile flash EEPROMsystem is then easily usable as an alternative in a computer systemdesigned to include such disk drives.

According to yet another aspect of the present invention, a flash EEPROMsystem is provided in a PC card or other industry standard memory systempackage with a controller for directly interfacing the system with acomputer system bus. No extra adaptation is required to use such anon-volatile, non-mechanical mass memory in computer systems whosehardware and software operating systems are designed to accept and usedisk systems. The internal controller converts the computer businterface and signal protocols to those required to operate the flashEEPROM memory.

Additional objects, features and advantages of the various aspects ofthe present invention will become apparent from the followingdescription of its preferred embodiments, which description should betaken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of first embodiment of a controller cardhaving multiple sockets adapted to receive multiple PC cards and beconnected to a host computer system bus;

FIG. 2 is a side view of the memory system of FIG. 1 with the PC cardsand a connector in place;

FIG. 3 illustrates generally, in block diagram form, the electricalconnections of the memory system of FIGS. 1 and 2;

FIG. 4 is an exploded view of an internal construction of a PC cardshowing the use of a main circuit board carrying sub-boards that eachhave several integrated circuit memory chips attached to them;

FIG. 5 is a sectional view of a PC card using the board structure ofFIG. 4, taken at section 5-5 of FIGS. 1 and 4;

FIGS. 6 and 7 are sectional views of a sub-board in the assembly ofFIGS. 4 and 5, taken respectively at sections 6-6 and 7-7 of FIG. 4;

FIG. 8 is a sectional view of a PC card showing a modification of FIG. 5wherein a controller sub-board is included;

FIG. 9 illustrates, in an electrical block diagram form, a memory systemutilizing two or more PC cards having a controller included within themin accordance with the structure of FIG. 8;

FIG. 10 is a side view of a second embodiment of a controller cardhaving a socket adapted to receive a PC memory card, and also includingfixed memory;

FIG. 11 is an end view of the controller card of FIG. 10;

FIG. 12 shows an electronic block diagram of a computer system in whicha PC card containing flash EEPROM memory and its controller is used;

FIGS. 13A and 13B together form a schematic block diagram showing theelectronic system within a PC card shown in the system of FIG. 12;

FIG. 14 illustrates a technique of addressing the flash EEPROM memorywithin the PC card system of FIGS. 13A and 13B;

FIG. 15 outlines a sector organization of the flash EEPROM integratedcircuit memory cells;

FIG. 16 shows expanded detail of a portion of FIG. 13A; and

FIG. 17, consisting of FIGS. 17A and 17B, is a flow diagram which showsan operation of the system of FIGS. 13A and 13B.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Several physical configurations of a memory card system are describedwith respect to FIGS. 1-11. An example electronic system within such acard, including both flash EEPROM and controller integrated circuitchips, is described with respect to FIGS. 12-17.

Physical Memory Card Configurations

Referring initially to FIGS. 1-3, one embodiment of a PC card flashEEPROM memory is illustrated. A structurally rigid printed circuit board11 contains on one side various circuit components 13 that form a memorycontroller. The controller circuit is operably connected with a row ofconnector pins 15 attached to the board 11. A connector 17, provided atan end of a ribbon cable 19, is adapted to interconnect the conductorsof the cable 19 to the row of pins 15. Another end (not shown) of theribbon cable 19 is connectable with a microcomputer system bus.Alternatively, the controller board 11 could be provided with adifferent type of connector that is adapted to fit directly into anexpansion slot of a microcomputer system.

On an opposite side of the controller board 11 from the controllercircuit chips 13 are two PC card receiving slots 21 and 23. These slotshave respective rows 25 and 27 of conductor pins. The slot and pinarrangement is dimensioned to receive respective PC cards 29 and 31 formechanical and electrical inter-connection therewith. The rows of pins25 and 27 are connected to the controller circuit 13. The PC cards 29and 31 contain a plurality of flash EEPROM memory chips, a preferredarrangement thereof being discussed in detail below. The PC cards 29 and31 conform to the PC Card Standard identified above, which isincorporated herein by this reference. Of course, other sized cards maybe used instead, depending upon the particular application.

Although two sockets 21 and 23 are indicated in FIGS. 1-3, thisembodiment may be varied to contain only one socket or to include threeor more sockets. As FIG. 2 shows, both of the PC cards 29 and 31 can beinserted and electrically interconnected with the controller 13 at onetime. If additional sockets are provided, additional cards can similarlybe simultaneously utilized. The removability of the memory cards allowsthem to be used much like floppy disks are currently used. As indicatedin FIG. 3, additional flash EEPROM memory 33 can be provided on theunderside of the controller board 11 itself as fixed memory. An exampleof a controller card having an amount of fixed memory is given inanother embodiment shown in FIGS. 10 and 11.

FIGS. 4 and 5 illustrate a preferred printed circuit board structure formounting and interconnecting a plurality of individual flash EEPROMintegrated circuit chips (up to 24 in this example). A mainrectangularly-shaped printed circuit board 35 has outside dimensionsslightly smaller than those of the outside of the PC card in which it isinstalled. A plurality of sub-boards 37-42 are attached to oppositesurfaces of the main board 35 (in this case, six). Each of thesub-boards contains four integrated circuit EEPROM chips attached to asurface thereof opposite to that facing the main board 35. Two suchchips 43 and 45 are shown in FIG. 4 in conjunction with the sub-board37. Similarly, circuit chips 47-50 are indicated to be attached to asurface of the sub-board 40. Illustration of the remaining circuit chipsis omitted for clarity.

The main board 37 includes a center (core) supporting substrate withconductor traces formed on either side. A thin dielectric layer iscoated over the entire area of each of the surfaces, covering theconductor traces and any exposed portions of the core substrate materialsurfaces. The insulating material does not cover, however, various rowsof electrical contacts.

One such row of electrical contacts 51, and a similar row on an oppositeside of the main board 35 but not visible in FIG. 4, is provided acrossa narrow side of the main board 35 and forms the contacts for the rowsof pins 21 and 23 of FIG. 1. Traces beneath the insulation layer (notshown) then interconnect these edge contacts with various rows ofcontacts across both surfaces for interconnecting with the sub-boards,for example, a row 53 of contacts provided across the narrow width ofthe main board 35. A row of contacts 55 having the same spacing andpattern as the row 53 is provided along a large edge of therectangularly shaped sub-board 37. Thus, when the sub-board 37 ispositioned on a surface of the main board 35, its contacts 55 line upwith the row 53 of contacts. They are attached to one another bysoldering, or some other technique. Indeed, in most cases, the solderingof these contacts is the only form of mechanical attachment of thesub-board to the main board that is required. This makes the structurequite simple and expedient to assemble. However, if additionalattachment is believed necessary, a dot of epoxy can be applied betweeneach sub-board and the main board along a side of the sub-board oppositeto its row of edge contacts.

Similarly, five other rows of contacts are provided for accommodatingthe other five sub-boards shown in the example of FIGS. 4 and 5. Rows 57and 59 are on the same side of the main board 35 as the row 53. All rowson the main board 37 are parallel to each other and to the short edge ofthe board 35. Similar rows of contacts 61, 63 and 65 are shown in dottedoutline on the opposite surface of the main board 35. Most of theconductive traces are preferably provided on one side of the coresubstrate of the main board 35, these conductors then penetrating thatsub-board to connect with the contacts on an opposite side.

Referring to the cross-sectional PC card view of FIG. 5, each of thesub-boards is shown physically attached to the main board 35 only by itselectrical contacts. In either case, a plastic ring 67 surrounds itsoutside edges and forms the narrow sidewalls of the resulting PC card.Rows of holes 69 and 71 are provided at one end to accept socket pins,such as the pins 25 of FIG. 1, for contact with the edge connector ofthe main board 35, which includes the row 51 of contacts. Generallyrectangularly shaped, thin metal plates 73 and 75 are attached to theedge ring 67 to form opposite sides of the PC card. Metal layers arepreferred in order to provide highly desirable radio frequencyshielding. The outside layers 73 and 75 are generally connected withground potential of the memory circuit carried therein, usually V_(SS)of the computer system with which it is interconnected.

With reference to FIGS. 4, 6 and 7, the structure of the sub-boards andattachment of the memory chips to them will now be described. Takingsub-board 37 and its attached chip 45 as an example, the chip isprovided with its interconnecting pads 77 supplied along only one of thechip edges. This edge of each of the chips attached to the sub-board 37is then positioned to face the edge carrying the sub-board contacts 55.

The sub-boards are best illustrated by the sectional views of FIGS. 6and 7. A central core substrate layer 79 carries conductive traces onboth sides. For example, in the view of FIG. 6, a conductive trace 81 isattached to the top side of the central substrate layer 79 and in thesectional view of FIG. 7, taken at a different position, a trace 83 isso provided. The traces on the top side of the core substrate layer 79generally extend across the narrow width of the sub-board 37 whileconductive traces on the bottom side, such as traces 85, 87 and 89,generally extend in the long direction of the sub-board. The result is atype of matrix that makes it easy to interconnect the large number ofcontacts provided by multiple integrated circuit chips and the sub-boardcontacts 55. An electrical contact is made through the layer 79 when itis desired to interconnect traces on opposite sides thereof, such as toptrace 81 being connected with bottom trace 89 in the view of FIG. 6, andtop trace 83 being interconnected with bottom trace 87 in the view ofFIG. 7. Both sides of the substrate are covered with respective thininsulating layers 91 and 93.

Portions of the top side traces along the contact edge of the sub-boardare exposed, however, for wire bonding to pads of the chips attached tothem. For example, in the section of FIG. 6, a wire 95 is bonded betweenone pad of the chip 45 and the trace 81. In the section of FIG. 7,another wire 97 is bonded between a different pad of the chip 45 and anelectrically separate trace 83. In the example section of FIG. 6, thetrace 81 is connected with an edge contact 99, one of those in the rowof sub-board contacts 55. The wire 95 is then connected directly to thepin 99 a very short distance away. Others of the chips on the sub-board37 are similarly interconnected with the pin 99 by bonding to top traceswhich are interconnected with the bottom trace 89 that has beenconnected to the pin 99.

The section of FIG. 7 shows a different example, wherein the wire 97 isbonded to a top conductive trace 83 that is connected to a bottom trace87. Although not shown, the bottom trace 87 is connected somehow to oneof the conductors of the sub-board row of contacts 55. In the case ofFIG. 7, a pin 101 is interconnected on the bottom of the centralsubstrate 79 with the trace 85. That bottom trace then allows a pad, notshown, of the chip 45 to be electrically connected with it, andsimilarly for the other chips attached to the sub-board 37.

Surrounding the attached integrated circuit chips on a top side of thesub-board 37 is a plastic frame 103. That frame, in combination with anoverall encapsulation (not shown) of the chips on the top surface of thesub-boards, protects those chips.

Referring to FIGS. 8 and 9, a modification of the embodiment of FIGS.4-7 is shown with common elements indicated by the same reference numberbut with a prime (′) added. In this case, a sub-board 105 nearest theedge connector contains integrated circuit chips forming a controller.That is, one sub-board of memory chips is replaced with an on-boardcontroller so that the resulting PC card can be operated directly from acomputer system bus without having to use the external controller 13 ofthe embodiment of FIGS. 1-3. Most of the traces interconnecting the edgeconnector of the main board 35′ are connected directly with rows of mainboard contacts to which the controller sub-board 105 is electricallyconnected. Traces interconnecting the rows of contacts with whichprimary chip containing sub-boards are primarily attached also extend tocontacts with which the controller sub-board 105 is connected. Indeed,depending upon the design, enough controller sub-board contacts may berequired as to have rows along each of the opposing long sides of thesub-boards, as shown in FIG. 8, with corresponding parallel rows ofcontacts on the top surface of the main board 37′. Alternative tomounting the controller chips on a sub-board, they can be mounteddirectly onto the main board 35 in the space shown in FIG. 8 to beoccupied by the sub-board 105.

Referring to FIG. 9, a system utilizing such a card with internalcontroller is illustrated. Two such cards 107 and 109 are shown to beconnectable through a connector ill to a microcomputer system busthrough conductors 19′. Of course, any number of such cards, from 1 tomany, can be utilized in a single computer system having one or moresuch connectors. The connector 111 need not contain any electroniccomponents, except perhaps for buffers, amplifiers and the like. But nodata manipulation or other controller functions need be provided outsideof the cards 107 and 109, in this embodiment. Of course, more than twosuch PC cards can be utilized at a time by providing an expandedconnector 111.

Referring to FIGS. 10 and 11, a modification of the controller cardillustrated in FIGS. 1 and 2 is shown in orthogonal side and end views,respectively. A structurally rigid printed circuit board 121 is providedwith a single socket 123 for removably receiving a PC memory card 125 ofthe type discussed with respect to FIGS. 4-7 above. The printed circuitboard 121 is wide enough in this embodiment to accept a plurality ofpackaged integrated circuit chips 127 that form the memory controller. Aconnector 129 along one edge of the board 121 provides for connection tothe computer system through a ribbon cable or the like. Attached underthe board 121 are a plurality of sub-boards 130, in this case, six, ofthe type described earlier with respect to FIGS. 6 and 7. Each sub-boardcontains a plurality of flash EEPROM chips. The sub-boards are connectedto exposed contacts on the underside of the controller board 121 in thesame manner as utilized in the PC cards as described with respect toFIG. 5.

The controller board embodiment of FIGS. 10 and 11 provides acombination of fixed system flash EEPROM capacity, attached to theunderside of the board 121, and the ability to use removable PC cardsalso containing flash EEPROM chips. The controller formed byinterconnecting through traces on the controller board 121 the packagedcircuits 127 is connected with the computer system bus connector 129 andoperates both the fixed and removable EEPROM memory. Of course, one ormore additional sockets may be provided in order to accommodate multiplePC memory cards at one time.

In addition to packaging the flash memory within the industry standardPC memory card form factor discussed above, it is also desirable to beable to package such a memory system within an industry standard floppydisk drive or hard disk drive form factor. This allows the semiconductormemory to be easily physically substituted for a disk drive. An examplestandard, just being formed, is for a 1.8 inch hard disk drive with asmall form factor. Its dimensions are about 19 mm. in height, 54 mm. inwidth, and 73 mm. in length, as a maximum. As disk drives evolve overtime, their packages become smaller. The packaging techniques describedabove, particularly the use of sub-boards for mounting circuit chips,allow large solid state memory systems to be presented in the same smallpackages.

Electronic EEPROM and Controller System within a Package

It is preferred that the memory system included in a card or otherstandard package be self-sufficient so that it can electronicallyinterface at its connector with a standard computer bus interface. Onesuch standard is an integrated device electronics (“IDE”) interface.This interface is being used extensively with hard disk drives that havecontroller circuits integrated as part of the drive. Thus, the packagedEEPROM system as part of the present invention includes controllercircuits in order that the unit appears to the computer system as a diskdrive.

Referring to the general block diagram of FIG. 12, bus interfacecircuits 137 are shown as providing individual circuit connections 138according to the IDE interface specifications to a flash EEPROM memorypackage 139 that includes a controller circuit. The package 139 may be athin PC card as discussed above with respect to the figures, a packagehaving dimensions and capabilities similar to that of a hard disk drive,as mentioned previously, or various other convenient removable packages.The bus interface 137 is connected with a computer system bus 153. Atypical computer system is shown in FIG. 12 to include a microprocessor154, ROM 155, RAM 156 and input/output circuits 157, all connected withthe common bus 153. Of course, the memory system of the presentinvention can be utilized with other specific computer systems.

The IDE signal lines 138 connected to the memory package 139 include, asindicated in FIG. 12, the 16-bit data bus D0-D15 and three lines of anaddress bus, A0-A2. These lines are connected to the corresponding linesof the system bus 153 through buffers and drivers within the interfacecircuit 137. Similarly provided are system control signals IOR, IOW andRESET. The signals IOR and IOW affect, respectively, a read or writeoperation within the memory package 139 when toggling between states.

The IDE signal lines 138 also include control lines CS1 and CS2, whichserve as two of several address bit lines for the memory within thepackage 139. These signals are decoded from the higher level systemaddress lines A3 and up by appropriate circuits within the bus interfacecircuitry 137. Alternatively, the necessary address lines may becommunicated with the memory package 139 and this decoding circuitryprovided within the package. However, this occupies more pins within theconnector so is usually done in the manner being described.

A number of status signals are also provided by the memory within thepackage 139 to the computer system through the bus interface 137. Anexample is the signal identified as IOCS16 which notifies the systemwhether the memory module accepts an 8- or 16-bit transfer on the databus. Another line INTRQ provides an interrupt request from the memory tothe computer system. Of course, there are additional control and statussignals, as well as voltage supply and ground lines, that arecommunicated over the connector according to the IDE standard.

FIGS. 13A and 13B illustrate a preferred form of the memory system 139,being substantial duplicates of FIGS. 7A and 2A, respectively, of thesimultaneously filed application identified above. As described morecompletely in that application, a controller 133 includes a disk driveinterface 411 that utilizes a commercially available peripheralinterface chip 415 that is connected to the lines 138 which are, inturn, connected to the host computer system through mating connectorportions. The peripheral interface 415 transfers data between the hostcomputer and a memory controller 401 over a serial data link 421. Amicroprocessor 417 controls the peripheral interface 415 and memorycontroller 401 over an internal bus 423. An example of the peripheralinterface circuit 415 is an SH 265 disk controller chip available fromCirrus Logic, Inc. An example of the microprocessor 417 is a Motorola,Inc. 68HC11 part. The buffer memory 413 is static RAM and providestemporary storage of data being transferred between the memory unit 123and the host computer system. The memory controller 401 is described indetail in the aforementioned simultaneously filed application withrespect to its FIG. 8A. It is desirable to combine as much of theinterface 415 and the controller 401 onto a single integrated circuitchip.

The controller 133 of FIG. 13A is connected to at least one, andpreferably a plurality, of memory modules 131 of the type illustrated inFIG. 13B. Each memory module 131 includes a plurality of EEPROMintegrated circuit chips 141 physically connected together on asub-board 143. Each of the memory chips is connected with the controller133 over lines 135. Each of the memory chips 141 is programmed with aunique address by connection with a plurality of pads, such as the pads147 on one of the devices, being controlled by selectively groundingthem on mount 149.

Referring to FIG. 14, each of the EEPROM integrated circuits is formedon a small substrate chip with memory cells arranged in rows and columnsin quadrants 201, 203, 205 and 207. These individual quadrant arrays areconnected through interface circuits 209 to the controller lines 135 anda line 151. Each of the memory cells within a given quadrant, such asthe quadrant 201, is addressable by proper voltages applied tointersecting column bit and row driver lines. A sector of such memorycells contiguously arranged, such as a sector 211 shown as part of thequadrant 201, is erasable simultaneously by addressing the sector.

Referring to FIG. 15, the sector 211 is shown to be formed of four rows213 of memory cells, each row having a length 215 of enough cells tostore 128 bytes. Thus, the sector 211 stores 512 bytes, the samecapacity as a sector of disk storage according to prevailing diskstandards. A number of such sectors are provided adjacent to each other,each of which is separately addressable and erasable by a single commandin one clock cycle. An additional byte 217 of disk storage is providedas an extension of each row of EEPROM cells of the sector 211 for thepurpose of providing spare EEPROM cells to replace bad cells within thesector 211. Similarly, another byte 219 stores header and other commonoverhead information required for each sector. Additional details of thememory system operation can be had by reference to publishedinternational patent applications of the assignee hereof, namelyEuropean publication no. 392,895, dated Oct. 17, 1990, and PCTpublication no. WO 90/12400, dated Oct. 18, 1990.

The number of EEPROM cells, and thus the number of sectors, in each ofthe quadrants 201, 203, 205 and 207 (FIG. 14) is preferably made to bethe same. A given sector of cells is addressed by first designating theintegrated circuit chip, its quadrant and then the sector within thequadrant. The highest capacity memory unit is provided when all fourquadrants are utilized, of course, but the quadrant approach allowsmemory units of lower storage capacity to be manufactured with rejectedchips so long as at least one quadrant and the buffer portion 209 of arejected chip are operable. This thus allows making use of memory chipsthat would otherwise be discarded, and thus the provision of a lowercapacity memory unit at a much lower cost.

FIG. 14 additionally illustrates the manner in which the individual chipEEPROM integrated circuit chips 141 are addressed in order to read orwrite data in response to commands from the system computer. A box 221indicates a translation of the information applied to the memory unitover the lines 138. The address from the host computer designates a diskdrive head that is to be utilized for the data transfer, a datacylinder, a beginning sector number on that cylinder, and the number ofcontiguous sectors (sector count) in which the data is being read orwritten. The memory controller translates that address, as shown on theright hand side of block 221 of FIG. 14, into a chip number, thequadrant on the chip and a sector of memory cells within that quadrantthat is to be addressed. If more than one sector of data is beingtransferred during a single access by the host computer, a number ofEEPROM sector accesses equal to the disk sector count is accomplished.

The circuitry for accomplishing this address translation is illustratedin FIG. 16, a part of the controller 133 of FIG. 13A. The commerciallyavailable peripheral interface chip 415 includes a number of registerswhich are utilized to perform the translation. One group of registerswhich responds to a toggle of the IOR signal includes a status register223, a read head address register 225, read cylinder address registers227 and 229 (allows a 16-bit cylinder address), a read starting sectoraddress register 231, and a read sector count register 233. Similarly,another set of registers is written into or read by toggling the IOWsignal. These registers include a command register 235, a write headaddress register 237, write cylinder address registers 239 and 241, awrite starting sector address register 243, and a write sector countregister 245. Each pair of registers is addressable by the host computerwith a bit pattern indicated to the right of the registers of FIG. 16,involving the signals CS1, CS0 and A0-A2. Similarly, a read buffermemory 247 and a write buffer memory 249 are separately addressable.

The group of registers provide a temporary place for storing commandsfrom the host computer over the interface lines 138. When the computersystem wants to perform a read or write operation, it writes a READ orWRITE command into the command register 235 after writing into therespective sets of registers 225-233 or 237-245 the address, in diskdrive terms, of the sectors where the data is to be read or written.This is controlled by the basic input/output system (“BIOS”) that ispart of the computer operating system. The microprocessor 417, through amicroprocessor port 251, then reads the command from the commandregister 235 and the address from the appropriate read or writeregisters, and performs the translation and command. Once a command isdetected in the register 235, a BUSY signal is written into the statusregister 223 that the host computer can then read to know that thememory system is in the process of executing a command and cannotreceive another. Data is transferred between the buffer memory 413 andthe EEPROM memory through a data port 253. Once a commanded operationhas been performed, the microprocessor 417 then writes a NOT BUSYindication in the status register 223. Other registers are provided inthe commercially available peripheral interface chips, but those of themwhich are most important to the operation being described herein havebeen shown.

This operation under control of the microprocessor 417 (FIG. 13A) isillustrated in a general way by a flow diagram of FIG. 17. A first stepin the operation is for the command register 235 to be continuouslypolled in order to detect a command placed there by the host computersystem. Such a read operation is indicated by a block 261 and adetermination as to whether a new command has been written into theregister 235 or not is indicated by a block 263. If a new command hasnot been so written since that register was last accessed, then thesteps 261 and 263 are repeated. When a new command is detected, theprocessing moves to a step 265 where a BUSY status signal is written inthe register 223. The host computer, in polling the status register 223,will then not lead another command into the command register 235 until aNOT BUSY status is written into the register 223 at the end of thecurrent operation.

Other than READ and WRITE, other commands from the host processorinclude SEEK and RESTORE. These are commands that are intended to move adisk drive read/write head inbetween read and write operations foroptimal positioning. If one of these commands is detected, as indicatedby a block 267, a majority of the processing is skipped, proceedingimmediately to the writing of the NOT BUSY status in the register 223,as indicated by a block 269.

If the command is to READ data from the EEPROM system, or to WRITE datainto it, as indicated by a block 271, then one of two paths is taken inthe processing. If a READ operation is commanded, a step 273 reads theaddress, in disk drive terms, stored in the registers 225-223 by thehost computer. A next step 275 translates that disk address into a flashmemory address, as generally described in FIG. 14 with reference to anaddress translation block 221. This translation is most easilyaccomplished by an algorithm calculation or reference to a look up tablethat have a one-to-one correspondence between the disk address and theEEPROM address. That one-to-one correspondence is disturbed, of course,when a sector is found to have so many bad EEPROM cells that it must betaken out of service and replaced by another sector. The addresstranslation table is then dynamically altered.

After the address has been translated into EEPROM terms, a next step 276reads data from the flash memory and writes it into the read buffer 247.

Thereafter, in a step 277, the read data is compared with an expandedform of an error correction code (“ECC”) that has been stored with thedata. A common ECC format and algorithm used for disk drives is used.Next, in a step 278, the read data is transferred to the host computer.Any error that has been detected during the reading process is writteninto the status register 223, in a step 279. Following that, the step269 indicates to the host computer that the operation is complete bywriting NOT BUSY into the register 223. At that time, the systemcomputer will know that the read operation is complete and that it mayaccess the buffer read memory 247 over the interconnection lines 138 totransfer the read data to somewhere else in the computer system.

Returning to the decision block 271, the path for a WRITE command issimilar to that just described for a READ command. A first step 281 inresponse to such a command is to read the address from registers237-245, which have been written there by the host computer in diskdrive terms. A next step 283 translates that address into EEPROM terms,in the same way described with respect to the step 275. A final step 285is to execute the command by reading data which has been placed into thewrite buffer memory 249 by the host computer system and then writingthat data into the address EEPROM sectors. After that is complete, thesteps 279 and 269 are executed in the manner discussed above. Theprocess then returns to the beginning steps 261 and 263 to poll thecommand register 235 for a new command from the host computer system.

Although the various aspects of the present invention have beendescribed with respect to their preferred embodiments, it will beunderstood that the invention is entitled to protection within the fullscope of the appended claims.

1. In an enclosed rectangularly shaped computer memory card that is lessthan 5.5 centimeters in width, less than 9.0 centimeters in length andless than 6.0 millimeters in thickness, and having an electricalconnector along a narrow side thereof, a combination within said card,comprising: a main circuit board including electrical conductors carriedthereby that interconnect said connector and a plurality of groups ofsubstantially parallel rows of electrical contacts provided on oppositesurfaces of said board, each of said rows having substantially the samenumber and spacing of contacts, and a plurality of rectangularly shapedsub-boards each carrying a plurality of flash EEPROM integrated circuitchips electrical interconnected to a line of a plurality of electricalcontacts along only one edge of said sub-board, said line havingsubstantially the same number and spacing of contacts as does said maincircuit board rows of contacts, said sub-boards being attached to saidmain board with their edge contacts being electrically connected torespective ones of said plurality of rows of contacts on the main board.2. The memory card combination according to claim 1 wherein the circuitchips have contact pads provided along only one edge thereof, each ofthe circuit chips on a given sub-board being arranged with its contactpad edge facing the sub-board edge having the line of contacts, andwherein said sub-boards have conductors formed thereon whichelectrically interconnect said line of contacts to said circuit chippads.
 3. The memory card combination according to either of claims 1 and2 wherein said sub-boards are attached to said main board only throughtheir edge contacts being attached to said main board rows of contacts.4. The memory card combination according to claim 1 which additionallycomprises at least one integrated circuit chip carried by said mainboard and forming a controller to interface between a computer systembus and said memory chips, said controller chip being electricallyconnected in a path between said conductor and said main board rows ofcontacts.
 5. The memory card combination according to claim 4 whereinsaid at least one controller chip is attached to another sub-board whichin turn is mechanically and electrically attached to said main board.